| 许学国,刘凤梅,周诗雨.技术与标准匹配视角下中国集成电路技术机会识别研究[J].数字图书馆论坛,2026,22(6):81~90 |
| 技术与标准匹配视角下中国集成电路技术机会识别研究 |
| A Study on Identifying Technological Opportunities for China’s IC Industry from the Perspective of China-U.S. Technology-Standard Alignment |
| 投稿时间：2026-05-23 |
| DOI：10.3772/j.issn.1673–2286.2026.06.008 |
| 中文关键词: 技术机会识别；中美技术布局；技术与标准匹配；集成电路 |
| 英文关键词: U.S.-China Technology Layout; Technology-Standard Alignment; Identification of Technology Opportunities; Integrated Circuit |
| 基金项目:本研究得到数智赋能河南省制造业现代化产业体系转型升级的内生机制与实践路径研究（编号：262400411107）资助。 |
| 作者 | 单位 | | 许学国 | 上海大学管理学院 | | 刘凤梅 | 上海大学管理学院 | | 周诗雨 | 洛阳理工学院经济与管理学院 |
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| 摘要点击次数: 10 |
| 全文下载次数: 12 |
| 中文摘要: |
| 集成电路是人工智能、高性能计算、6G等前沿技术的基石，已成为大国科技竞争与产业链安全的战略制高点。识别中美集成电路技术布局差异、挖掘中国潜在技术机会，对推动我国实现集成电路产业自主可控、高质量发展具有重要意义。本研究基于中美集成电路的论文、专利与标准数据，运用高频关键词统计、共现网络、主题聚类方法系统识别并对比中美两国集成电路技术布局特征与发展差异。研究结果表明，中国侧重“材料—物理性能—器件”的基础探索，而美国聚焦于“工艺—设计—系统”的全链条融合；美国已形成科研与技术研发高度协同的成熟生态，而中国虽基础研究活跃但成果向技术应用转化尚显不足。通过技术与标准的匹配分析，本研究识别出中国集成电路领域四类关键技术机会：半导体材料与功能薄膜技术、CMOS电路设计与高速信息处理技术、先进器件结构与互连工艺技术、先进封装与异构集成技术。本研究可为我国集成电路技术攻关与标准布局提供重要参考依据。 |
| 英文摘要: |
| Integrated circuit (IC) is the foundation of frontier technologies such as artificial intelligence, high-performance computing, and 6G, and has become a strategic high ground in major-power technological competition and supply-chain security. Identifying differences in IC technology layout between China and U.S., as well as China’s potential technological opportunities, is of great significance for promoting the independent controllability and high-quality development. Based on Chinese and U.S. papers, patents, and standards in the IC field, this study employs high-frequency keyword analysis, co-occurrence networks, topic clustering, and technology-standard matching to identify China’s technological opportunities. The results show that China focuses more on fundamental exploration in materials, physics property, and devices, whereas U.S. maintains advantages across the process, design, system value chain. U.S. has developed a mature ecosystem characterized between scientific research and technological development, while China has active basic research but relatively insufficient translation of research outcomes into technological applications. Through technology-standard matching analysis, this study identifies four categories of key technological opportunities, including semiconductor materials and functional thin films, CMOS circuit design and high-speed information processing, advanced device structures and interconnect processes, and advanced packaging and heterogeneous integration. This research offers an important reference for China’s IC technology tackling and standard layout. |
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